Georgia Institute of Technology
Center for Board Assembly Research CBAR- advanced research on board assembly processes and systems
Research Institute / Laboratory / School
CBAR's mission is to address the industry's need for advanced research on board assembly processes and systems. Most of the Center's work is project based, stemming from problems identified by industry partners. Our primary focus is to deliver solutions to real world problems and transfer the knowledge directly to industry. Our main research areas include: Process Technology & Development, Production & Manufacturing Systems, Factory Information Systems, Electrical Test & AOI, and Roadmapping/Benchmarking & Standards.
Georgia Institute of Technology Postings
7 technical articles »
Feb 09, 2022 | Xuanke He, Bijan K. Tehrani, Ryan Bahr, Wenjing Su, and Manos M. Tentzeris
This article presents the first time that an millimeter-wave (mm-wave) multichip module (MCM) with on-demand "smart" encapsulation has been fabricated utilizing additive manufacturing technologies. RF and dc interconnects were fabricated using inkjet printing, while the encapsulation was realized using 3-D printing. Inkjet-printed interconnects feature superior RF performance, better mechanical reliability, and on-demand, low-cost fabrication process....
Aug 19, 2020 | Yun-Soung Kim, Musa Mahmood, Yongkuk Lee, Nam Kyun Kim, Shinjae Kwon, Robert Herbert, Donghyun Kim, Hee Cheol Cho,* and Woon-Hong Yeo*
Commercially available health monitors rely on rigid electronic housing coupled with aggressive adhesives and conductive gels, causing discomfort and inducing skin damage. Also, research-level skin-wearable devices, while excelling in some aspects, fall short as concept-only presentations due to the fundamental challenges of active wireless communication and integration as a single device platform. Here, an all-in-one, wireless, stretchable hybrid electronics with key capabilities for real-time physiological monitoring, automatic detection of signal abnormality via deep-learning, and a long-range wireless connectivity (up to 15 m) is introduced. The strategic integration of thin-film electronic layers with hyperelastic elastomers allows the overall device to adhere and deform naturally with the human body while maintaining the functionalities of the on-board electronics. The stretchable electrodes with optimized structures for intimate skin contact are capable of generating clinical-grade electrocardiograms and accurate analysis of heart and respiratory rates while the motion sensor assesses physical activities. Implementation of convolutional neural networks for real-time physiological classifications demonstrates the feasibility of multifaceted analysis with a high clinical relevance. Finally, in vivo demonstrations with animals and human subjects in various scenarios reveal the versatility of the device as both a health monitor and a viable research tool....
Additive Manufacturing for Next Generation Microwave Electronics and Antennas
Aug 13, 2020 | Xuanke He, Bijan K. Tehrani, Ryan A. Bahr, Manos Tentzeris
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. With the recent advancements in 3D and inkjet printing technology, achieving resolution down to 50 um, it is feasible to fabricate electronic components and antennas operating in the millimeter-wave regime. The nature of additive manufacturing allows designers to create custom components and devices for specialized applications and provides an excellent and inexpensive way of prototyping electronic designs. The combination of multiple printable materials enables the vertical integration of conductive, dielectric, and semi-conductive materials which are the fundamental components of passive and active circuit elements such as inductors, capacitors, diodes, and transistors. Also, the on-demand manner of printing can eliminate the use of subtractive fabrication processes, which are necessary for conventional microfabrication processes such as photolithography, and drastically reduce the cost and material waste of fabrication....
Jul 22, 2020 | Saswat Mishra et al
Recent advancements in electronic packaging and image processing techniques have opened the possibility for optics-based portable eye tracking approaches, but technical and safety hurdles limit safe implementation toward wearable applications. Here, we introduce a fully wearable, wireless soft electronic system that offers a portable, highly sensitive tracking of eye movements (vergence) via the combination of skin-conformal sensors and a virtual reality system. Advancement of material processing and printing technologies based on aerosol jet printing enables reliable manufacturing of skin-like sensors, while the flexible hybrid circuit based on elastomer and chip integration allows comfortable integration with a user's head. Analytical and computational study of a data classification algorithm provides a highly accurate tool for real-time detection and classification of ocular motions. In vivo demonstration with 14 human subjects captures the potential of the wearable electronics as a portable therapy system, whose minimized form factor facilitates seamless interplay with traditional wearable hardware....
Jun 10, 2020 | Yun-Soung Kim and Woon-Hong Yeo
Recent advancement of flexible wearable electronics allows significant enhancement of portable, continuous health monitoring and persistent human-machine interfaces. Enabled by flexible electronic systems, smart and connected bioelectronics are accelerating the integration of innovative information science and engineering strategies, ultimately driving the rapid transformation of healthcare and medicine. Recent progress in the development and engineering of soft materials has provided various opportunities to design different types of mechanically deformable systems towards smart and connected bioelectronics....
Aug 10, 2017 | Sukhadha Viswanathan, Tomonori Ogawa, Kaya Demir, Timothy B. Huang, P. Markondeya Raj, Fuhan Liu, Venky Sundaram, Rao Tummala
This paper demonstrates the high frequency performance and thermo-mechanical reliability of through vias with 25 μm diameter at 50 μm pitch in 100 μm thin glass substrates. Scaling of through via interconnect diameter and pitch has several electrical performance advantages for high bandwidth 2.5D interposers as well as mm-wave components for 5G modules....
Modeling and Control of SMT Manufacturing Lines Using Hybrid Dynamic Systems
Apr 05, 2012 | L.G. Barajas, A. Kansal, A. Saxena, M. Egerstedt, A. Goldstein, E.W. Kamen
In this paper we show how hybrid control and modeling tech-niques can be put to work for solving a problem of industrial relevance in Surface Mount Technology (SMT) manufacturing. In particular, by closing the loop over the stencil printing process, we ob...
