Taiwan Dry Tech Corp.

Millions of users worldwide use Eureka Auto Dry Cabinet dry boxes, and desiccator sproducts in controlling relative humidity (RH) / moisture & humidity control in EMS designing, R&D, testing, manufacturing, assembly, and storage to solve all moisture related problems.

Moisture sensitivity in SMT is an increasing problem as the industry shifts to lead-free high temperature reflow process. Serious manufacturing defects and failures in surface mount technology, are resulted from improper storage and handling methods of moisture sensitive components and PCBs during assembly process. Without proper moisture control, field failures will occur. Especially important factor for industries where product reliability must be tightly controlled such as automotive, defense, medical devices, aeronautics & aviation industries.

Trace moisture causes failures to components and PCBs during high temperature reflow process. When absorbed moisture rapidly expand from high temperatures, common internal component damages and failures such as micro-cracking, blistering, popcorn effects will occur in moisture sensitive devices, packages and components.

Printed Circuit Boards are hygroscopic. Absorbed moisture will lead to delamination in PCB when moisture inside the layers causes expansion during the reflow process.
Moisture problems solved with Eureka’s Ultra-low Humidity Storage

Eureka’s dry cabinets, dry boxes, and desiccators will provide ultra-low humidity storage environment conforming to IPC/JEDEC J-STD 033 & IPC-1601, storage and handling standards for MSDs and PCBs.

Eureka Fast Super Dryer also dehumidifies during storage, providing alternative drying methods optimal for removing moisture in all moisture sensitive materials in SMT production, solving all moisture damage problems during reflow process.

Effective moisture damage solution that improves yields:

Eureka’s ultra-low humidity cabinets are affordable and effective solution in removing moisture in the production process, eliminating moisture related problems without using nitrogen / dry air purging. Eureka’s Fast Super Dryer dry cabinets can be used as an alternative to baking components and PCBs, eliminating heat baking related problems such as oxidation, solderability. All of which will increase your product reliability and yields.

• Baking process uses high temperature to dry PCBs and will cause breakdowns of protective coatings, lead oxidation, intermetallic buildup and reduces solder ability of circuit boards.
• Nitrogen and dry air purge is costly and will only force moisture from the storage cabinet providing a humidity controlled environment. Nitrogen purging will not dry or remove moisture that has absorbed into the moisture sensitive materials, components or devices.

Features of Eureka Fast Super Dryer’s Ultra-low Humidity Storage:

• Eureka Fast Super Dryer dry cabinets provides options of <5% RH, <10% RH, <20% RH with fast recovery times in ambient temperature and pressure without using costly nitrogen (N2) or dry air purging. Providing storage for all moisture sensitivity levels (MSL) solving all moisture related problems while increasing yield rates.
• Moisture is removed and expelled from the cabinets by the use of desiccant dehumidifiers which automatically regenerates. No fan is required to ventilate.
• All of Eureka’s Dry Cabinets features dual hygrometer sensor designs with independent hygrometer monitoring relative humidity levels inside the cabinet.
• Eureka’s Fast Super Dryer will provide moisture sensitive devices indefinite floor-life meeting IPC/JEDEC J-STD 033 standards.
• Eureka’s dry cabinets will provide storage environment meeting IPC 1601 standards optimal for multi-layer Printed Circuit Board / Printed Wire Boards.
• All of Eureka’s Fast Super Dryer dry cabinets are equipped with anti-static paint, glass, casters and 1M ohm grounding cable meeting IEC-61340-5-1 (ESD) Standard.

Application of Eureka’s Fast Super Dryers:

• When components are removed from moisture barrier bags (MBB), Eureka’s ultra-low humidity storage cabinet will stop floor life clock for all IC packages such as:

Dual-in-line: flatpack, SOIC, SOJ, TSOP, SSOP, TSSOP, QSOP, VSOP, DFN
Quad-in-line: PLCC, QFP, LQFP, PQFP, CQFP, MQFP, TQFP, QFN, LCC, MLP, PQFN
Grid arrays: PGA, BGA, LGA, FBGA, LFBGA, TFBGA, CGA, CCGA, μBGA, LLP

• Drying and storage of multi-layer PCB and PWB before and after mounting, including dual side boards awaiting second side reflow.
• Moisture controlled storage with drying/desiccating capabilities for PCB pattern film/prepreg, quartz, fiber optics, CCDs, etc.

Contact us today for solution consultation with any moisture problems faced or for details about our distributor and agent programs.