Texas Instruments

BGA Package Component Reliability After Long-Term Storage

Dec 03, 2009 | R. Key, B. Lange, R. Madsen

This paper provides additional data in support of shelf life extension for BGA and Die Size BGA (DSBGA) Packages....

Component Reliability After Long Term Storage

Dec 03, 2009 | R. R. Madsen

Each year the semiconductor industry routes a significant volume of devices to recycling sites for no reliability or quality rationale beyond the fact that those devices were stored on a warehouse shelf for two years. This study identifies the key risks attributed to extended storage of devices in uncontrolled indoor environments and the risk mitigation required to permit safe shelf-life extension....

A HDMI Design Guide For Successful High-Speed PCB Design

Mar 25, 2009 | Thomas Kugelstadt, Senior Systems Engineer; Texas Instruments Inc.

This article presents design guidelines for helping users of HDMI mux-repeaters to maximize the device's full performance through careful printed circuit board (PCB) design. We'll explain important concepts of some main aspects of high-speed PCB design with recommendations. This discussion will cover layer stack, differential traces, controlled impedance transmission lines, discontinuities, routing guidelines, reference planes, vias and decoupling capacitors....

Printed Circuit Board Tracking with RFID: Speed, Efficiency and Productivity Made Simple.

May 07, 2008 | Chris Cook, Hank Tomarelli.

Tracking goods through manufacturing was originally accomplished with pencil, paper and human input. Barcodes introduced an automated, machine-readable tracking mechanism that streamlined all types of manufacturing. But modern printed circuit board (PCB) assemblies are running into limitations because of barcode labels. And though barcodes and RFID tags will co-exist, the relatively large barcode labels have to find increasingly scarce real estate on high density boards....