Saturn Electronics Corporation
Providing production and prototype, SEC offers advanced technologies like LED thermal management, heavy copper, PTFE for RFMW, open and internal cavities and blind and buried vias that are certified to a diverse set of industries.
Consultant / Service Provider, Manufacturer
Circuit Board Manufacturing
Top 10 domestic bare printed circuit board manufacturer
Advanced Technologies
Aluminum PCBs, Heavy Copper, Thermal Management, Blind / Buried Vias, Edge Plating Castellations,. RF Microwave Boards, and Via in Pad technology.
Certifications
TS16949, AS9100, ITAR Registered and UL Certifications for additional thermal management materials to include Nelco 4000-13 series of materials, Bergquist, Iteq, Ventec, Laird and many more featured on our list of UL certified PCBs. In addition, we have just completed qualification for 8Layer 7000 requirements pertaining to automotive high reliability certification.
Saturn Electronics Corporation is a Minority Business Enterprise.
Saturn Electronics Corporation Postings
13 products »
This high power 6 layer PCB with heatsinks has an ENIG finish....
RFMW PCB with Cavity for SMA Connector
This 4-layer Radio Frequency Microwave Board features cavities for SMA connectors and has an ENIG Finish...
This 26-layer Stator board features 7 ounce layers (182oz total), and ENIG finish and Blind and Buried Vias....
This is a 2-layer 20 ounce Heavy copper PCB used in Hi-Power applications. ...
Quick turn service for PCB prototyping fabrication for advanced, cutting-edge technologies...
Edge Plating PCB / Castellations
Edge Plating does not have a set definition per IPC. However, the industry generally accepts this as being copper plating that continues from the top and bottom surfaces and along one or more perimeter edges. Edge Plating can be used for a vari...
10-Layer Via-in-Pad Technology PCB features blind via in L9-10 in addition to the Fine Pitch BGA. Putting the via in the pad creates space on the external layers for more routing and avoids potential shorts during as...
Internal-Cavity boards are multilayer designs that require air gaps in internal layers. Again, this requires laminating precut materials, tight processing controls, manufacturing versatility, and standardized Multi-Line tooling systems to manufacture...
Cavity boards are multilayer designs that expose inner layers to air by requiring pockets of material to be cut out. This requires laminating precut materials, controlled-depth fabrication, tight processing controls, and manufacturing versatility. Al...
42 news releases »
Saturn Electronics Corporation Supporting U of M Autonomy project
Mar 30, 2016 | Ann Arbor Michigan March 25st 2016 - Saturn Electronics Corporation will be supporting the U of M Autonomy student project from the College Of Engineering, in the Association for Unmanned Vehicle Systems International Roboboat Competition held on July 4 - 10, 2016. Virginia Beach, VA
Oct 21, 2014 | The University of Michigan Solar Car Team will be representing Saturn Electronics Corporation at the 2014 SAE Convergence in Detroit, Michigan. They will be exhibiting their 2011 vehicle, Quantum, which most recently raced in the 2014 American Solar Challenge, where it won its 2nd national championship title, the most recent of the 8 in the team’s history. Along with their car, they will also be exhibiting some of the many boards that Saturn Electronics Corporation manufactures for the team.
Domestic PCB Fabricator Certifies Nine Employees as IPC Application Specialists Per IPC-A-600
Mar 18, 2013 | Last week, in accordance with IPC-A-600, North American bare board manufacturer Saturn Electronics Corporation certified nine Michigan-based employees as IPC Application Specialists.
Consult LED Thermal Management Expert
Mar 16, 2011 | Free Consultation with Clemens Lasance at IPC Vegas
Nov 09, 2010 | With IPC-4761 as its guide, PCB Manufacturer sheds light on Via Plugging from the fabrication perspective.
Yash Sutariya to Present at IPC Technology Interchange on Thermal Management: Getting the Heat Out
Sep 30, 2010 | Presentation entitled "Thermal Management in End Applications: Dissipating the Heat Away from the Base of LEDs" to address material specifications for Metal Core / Aluminum PCBs for LED Applications.
Sep 08, 2010 | PCB Fabricator Installs MASS VHF 300 VS for Via Hole Filling
Addressing the continuous demands pertaining to via hole filling, through holes and blind vias
New Material & Fabrication Process Improves LED PCB Thermal Conductivity
Mar 05, 2010 | New thermal management solution from PCB fabricator and technology partner signals major changes for circuit board industry with respect to thermal management applications
Thermal Management for LED Applications
Dec 01, 2009 | What is the Role of the PCB?
Oct 27, 2009 | Metal Core LED Circuit Boards
