MARTIN (a Finetech company)
Manufacturer of rework and reballing systems, hand soldering solutions, and micro-dispensing technologies
Martin's USA demo and application center is located in Manchester, NH, with a second facility in Gilbert, AZ. From here we support all North American installations for service, support and training. Our highly trained engineers are experienced in types of rework applications and can assist with processes, nozzles, stencils , spares and customization.
Production is based out of the factory at Martin GmbH near Munich, Germany where a commitment to high quality, precision and reliability has driven technology for nearly 30 years. Martin is a Finetech company (Berlin, Germany).
MARTIN (a Finetech company) Postings
6 products »
MARTIN Expert 10.6 - Automated Rework Station for SMT Components
The EXPERT 10.6 systems are rework stations that handle the complete rework process for SMDs. All versions utilize Auto Vision Placement Technology and are expandable with residual solder removal and dispensing functions....
MARTIN Expert 4.6 - Manual BGA Rework Station
The EXPERT 04.6 systems with Hot Air and IR Technology are complete rework stations for manual soldering of SMDs, residual solder removal and dispensing. Soldering profiles can be easily established and supported with the supplied software pack...
Martin MiniOven-05 - Desktop Reflow Oven
Desktop Reflow Oven For Reballing and Prebumping of SMD Components The new MiniOven-04 is perfectly suitable for a wide range of applications, from small QFNs to very large BGAs. This is due to our extensive selection of stencil...
DOT LINER 6.6 - Automated Dispenser
Dispensing Equipment for Small Batches and Rework Micro dispensing for small batches and rework. Precisely dispense solder paste, epoxy and underfill with the highest consistency, even for the smallest dots. For 25 years...
MARTIN Clever Dispense - Manual Dispenser
Manual dispensing with high quality results Dispensing varied materials across a wide range of viscosities - using the same equipment! Especially solder pastes and other filled media have always been particularly demanding when rel...
Underheater for demanding soldering Applications for underheaters range from pre-heating of PCBs for hand soldering tasks over pre-heating for automated machine rework to curing or cracking of underfill. MARTIN offers a...
2 technical articles »
Effect of BGA Reballing and its Influence on Ball Shear Strength
Jul 11, 2013 | S. Manian Ramkumar Ph.D., Andrew J. Daya, Daniel B. Lewanda; Rochester Institute of Technology, Scott Rushia; MARTIN
This research paper will focus on the effect of various parameters that are used to reball a BGA and their effect on the overall shear strength. Factors that will be looked at include the type of BGA (SAC305 or 63Sn/37Pb), the alloy used to reball (SAC405 or 63Sn/37Pb), the type of flux used (Water Soluble or No Clean), and the environment in which reballing takes place (Nitrogen or Ambient)....
A Case Study in Troubleshooting Shop Floor Rework Difficulties
Apr 05, 2007 | Martin Hogner; Martin Rework and Dispense Technic, Wessling/Munich, Germany, and Allen Sirois; Web Administrator, Manncorp Inc., USA.
Recently a large global player approached us with a problem. They needed an initial assembly solution for brand new components. Their boards and CSP specimens could not safely be soldered due to wetting problems at the solder joints....
8 news releases »
MARTIN Introduces IR Temperature Measurement Sensors for ENHANCED Rework
Apr 24, 2013 | MARTIN is announces that Infrared temperature (IR) measurement sensors now are available on its EXPERT 10.6 Rework Systems
MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at the SMTA Toronto Expo and Tech Forum
Apr 19, 2012 | MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Toronto Expo & Tech Forum,
MARTIN to Demonstrate Affordable Rework Solutions at the 2012 IPC APEX Expo
Jan 20, 2012 | MARTIN will showcase its MINIOVEN Reball/Prebump unit, Expert 10.6 rework system and Clever Dispense unit at the upcoming IPC APEX Expo.
MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at SMTA LA/Orange County Expo
Oct 07, 2011 | MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA LA/Orange County Expo & Tech Forum.
MARTIN to Demonstrate Affordable Rework System and Mini-Oven Reball/PreBump Unit at SMTAI 2011
Sep 19, 2011 | MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system in Booth #407 at the upcoming SMTA International Conference & Exhibition.
LEDs Are Well On The Way To Becoming The Most Innovative Components With The Fastest Growth Rate
Jul 27, 2011 | The use of these small, illuminating and energy efficient components is steadily increasing, thereby influencing electronic assemblers to seriously consider the placement, soldering and possible rework of LEDs.
MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Space Coast Expo & Tech Forum
May 10, 2011 | MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming Space Coast Expo and Tech Forum, scheduled to take place June 9, 2011 at the Melbourne Auditorium in Melbourne, FL.
MARTIN Launches Web Site for North American Market
Apr 07, 2011 | MARTIN announces the launch of its new North American Web site. The new easy-to-navigate site, located at www.bgarework.com, highlights the company’s rework and dispensing products available in North America.
