YINCAE Advanced Materials, LLC.

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Manufacturer

The Global Leader in Solder Joint Encapsulants, Nanofilms, and Underfils.

The YINCAE brand is a name recognized worldwide as an industry leader in the development of advanced mirco-electronic grade materials used in the computer microchip and optoelectronics industries.

YINCAE products are designed to facilitate smarter and faster production for customers at lower costs without sacrificing quality. We are committed to meeting the demands of rapidly advancing industries while supporting green initiatives.

YINCAE Advanced Materials, LLC. Postings

26 products »

Low Temperature Reflowable Underfill Material: SMT 160L

(Albany, NY) 1/3/2018 – YINCAE Advanced Materials has recently developed a low temperature curable reflowable (no flow) underfill: SMT 160L. This product is designed to eliminate capillary underfills, simpli...

Materials

DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials

(Albany, NY) December 22, 2017 – The DA 150 series materials are YINCAE’s new fast curing die attach adhesives. The DA 150 series offers conductive and insulating options to suit a large variety of applications. These...

Materials

YINCAE’S New Reflowable Underfill Material: SMT 160

(Albany, NY) 1/2/2018 – YINCAE Advanced Materials has recently developed a reflowable (no flow) underfill: SMT 160. This product is designed to eliminate capillary underfills, simplify the assembly process,...

Materials

High Purity Liquid Encapsulant: SMT 158HA

 YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA    (Albany, NY) 10/20/2017 – YINCAE Advanced Materials has recently developed a unique amine based high purity liquid epoxy encapsulant: SMT 158HA. SM...

Materials

 High Purity Liquid Encapsulant: SMT 158HA

SMT 88UL Super-Fast Flow Room Temperature Underfill

SMT 88UL is a super-fast flow capillary underfill, which can flow into 10μ gap at room temperature without preheating a substrate. After cure, there is void free in underfill. The cured SMT 88UL can be easily reworked. SMT 88UL...

Materials

SMT 88UL Super-Fast Flow Room Temperature Underfill

SMT 158UL Room Temperature Underfill

SMT 158UL is a super-fast flow capillary underfill, which can flow into 10μm gap at room temperature without preheating a substrate. After cure there is void free in underfill. The cured SMT 158UL can be easily reworked. SMT 158UL not only can...

Materials

SMT 158UL Room Temperature Underfill

BP 256 Ball Attach Adhesive

BP 256 ball attach adhesives have been designed to enhance solder joint reliability and eliminate cleaning process for ball bumping process of CSP, BGA, Flip chip and PoP (package on package) and so on, particularly for lead free application. Duri...

Materials

BP 256 Ball Attach Adhesive

SMT 158D High Thermal Conductive Underfill

SMT 158D high thermal conductive underfill is a capillary flow underfill, low temperature cure, fast flowing, easy reworking liquid epoxy which can be used as a underfill for flip chip, chip scale package, ball grid array devices, package on packa...

Materials

SMT 158D High Thermal Conductive Underfill

SMT 256EP Solder Joint Encapsulant Paste

SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical a...

Materials

SMT 256EP Solder Joint Encapsulant Paste

SMT 266 Solder Joint Encapsulant

SMT266 offers all the features and advantages of our SMT256 series, in a convenient jetting adhesive form (and can also be brushed on during rework).  SMT 266 series spray adhesives have been designed to enhance solder joint reliabi...

Materials

SMT 266 Solder Joint Encapsulant

See all products from YINCAE Advanced Materials, LLC. »

15 technical articles »

High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives

Apr 05, 2018 | Dr. Mary Liu and Dr. Wusheng Yin

The miniaturization of microchips is always driving force for revolution and innovation in the electronic industry. When the pitch of bumps is getting smaller and smaller the ball size has to be gradually reduced. However, the reliability of smaller ball size is getting weaker and weaker, so some traditional methods such as capillary underfilling, corner bonding and edge bonding process have been being implemented in board level assembly process to enhance drop and thermal cycling performance. These traditional processes have been increasingly considered to be bottleneck for further miniaturization because the completion of these processes demands more space. So the interest of eliminating these processes has been increased. To meet this demand, YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. In this paper we will discuss the ball bumping process, the reliability such as strength of solder joints, drop test performance and thermal cycling performance. ...

High Reliability and High Temperature Application Solution - Solder Joint Encapsulant Paste

Oct 16, 2017 | Dr. Mary Liu and Dr. Wusheng Yin

The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail. ...

A High Thermal Conductive Solderable Adhesive

Nov 17, 2016 | Dr. Mary Liu and Dr Wusheng Yin

With increasing LED development and production, thermal issues are becoming more and more important for LED devices, particularly true for high power LED and also for other high power devices. In order to dissipate the heat from the device efficiently, Au80Sn20 alloy is being used in the industry now. However there are a few drawbacks for Au80Sn20 process: (1) higher soldering temperature, usually higher than 320°C; (2) low process yield; (3) too expensive. In order to overcome the shortcomings of Au80Sn20 process, YINCAE Advanced Materials, LLC has invented a new solderable adhesive – TM 230. Solderable adhesives are epoxy based silver adhesives. During the die attach reflow process, the solder material on silver can solder silver together, and die with pad together. After soldering, epoxy can encapsulate the soldered interface, so that the thermal conductivity can be as high as 58 W/mk. In comparison to Au80Sn20 reflow process, the solderable adhesive has the following advantages: (1) low process temperature – reflow peak temperature of 230°C; (2) high process yield – mass reflow process instead of thermal compression bonding process; (3) low cost ownership. In this paper we are going to present the die attach process of solderable adhesive and the reliability test. After 1000 h lighting of LED, it has been found that there is almost no decay in the light intensity by using solderable adhesive – TM 230. ...

Room Temperature Fast Flow Reworkable Underfill For LGA

Oct 03, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

With the miniaturization of electronic device, Land Grid Array (LGA) or QFN has been widely used in consumer electronic products. However there is only 20-30 microns gap left between LGA and the substrate, it is very difficult for capillary underfill to flow into the large LGA component at room temperature. Insufficient underfilling will lead to the loss of quality control and the poor reliability issue. In order to resolve these issues, a room temperature fast flow reworkable underfill has been successfully developed with excellent flowability. The underfill can flow into 20 microns gap and complete the flow of 15mm distance for about 30 seconds at room temperature. The curing behavior, storage, thermal cycling performance and reworkability will be discussed in details in this paper....

A Low Cost Manufacturing Solution - Low Temperature Super-Fast Cure and Flow Reworkable Underfill

Jan 12, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

In order to meet the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, underfilling has increasingly become an essential process for the good reliability of electronic devices. Filled capillary underfill has been selected for used in package-level where there is large thermal stress caused by CTE mismatch issue, but the underfill is usually not reworkable. Unfilled capillary underfill has been used for board-level application such as BGA/CSP, POP, WL-CSP where there is need for mechanical shock resistance, the underfill is usually reworkable....

A Room Temperature Stable and Jetable Solder Joint Encapsulant Adhesive - Capillary Underfill Replacement

Jan 12, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

With the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, YINCAE has published a white paper on a first individual solder joint encapsulant which can eliminate underfilling process with at least five times solder joint increase and provide more flexibility for fine pitch and high density application. In order to meet the demand of manufacturing of high speed and low cost, YINCAE has invented a room temperature stable and jettable solder joint encapsulant adhesive – SMT 266. The invention of SMT 266 has allowed our customers to have more flexibility in their high-speed production line such as worry free on the work life of adhesive and workable jetting process....

A Low Temperature Solder Joint Encapsulant for Sn/Bi Applications

Jan 12, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

The electronic industry is currently very interested in low temperature soldering processes such as using Sn/Bi alloy to improve process yield, eliminate the head-in-pillow effect, and enhance rework yield. However, Sn/Bi alloy is not strong enough to replace lead-free (SAC) and eutectic Sn/Pb alloys in most applications. In order to improve the strength of Sn/Bi solder joints, enhance mechanical performance, and improve reliability properties such as thermal cycling performance of soldered electronic devices, YINCAE has developed a low temperature solder joint encapsulant for Sn/Bi soldering applications. This low temperature solder joint encapsulant can be dipped, dispensed, or printed. After reflow with Sn/Bi solder paste or alloy, solder joint encapsulant encapsulates the solder joint. As a result, the strength of solder joints is enhanced by several times, and thermal cycling performance is significantly improved. All details will be discussed in this paper....

Solderable Anisotropic Conductive Adhesives for 3D Package Applications

Jan 12, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

3D packaging has recently become very attractive because it can provide more flexibility in device design and supply chain, reduce the gap between silicon die and organic substrate, help miniaturize devices and meet the demand of high speed, provide more memory, more function and low cost. With the advancement of 3D packaging, the bump height is now down from 80μ to 10μ. When the bump diameter is 20-40μ and height 10μ, the process and reliability are obvious issues. It is well known that underfill can enhance the reliability for regular flip chip, however underfill won’t help assembly process. In order to resolve some difficulties that 3D packaging faces, YINCAE Advanced Materials, LLC has developed solderable anisotropic conductive adhesives for 3D package applications. In this paper we will discuss the assembly process and reliability in detail....

An Innovative Reliability Solution to Interconnect of Flexible/Rigid Substrates

Jan 12, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

With the pitch size of interconnect getting finer and finer, the bonding strength between flexible and rigid (e.g. PCB, ceramic) substrates becomes a serious issue because it is not strong enough to meet the customer’s requirement. Capillary underfill has been used to enhance the bonding strength between flexible and rigid substrates, but the enhancement is very limited, particularly for high temperature application. The bonding strength of underfilled flexible/rigid interconnect is dramatically decreased after being used at 180◦C, and the interconnects are weakened by the internal stress caused by the expansion of underfill at high temperatures. In order to resolve reliability issues of the interconnect between flexible/rigid substrates, solder joint encapsulant was implemented into the thermal compression bonding process, which was used to manufacture the interconnect between flexible/rigid substrates. Compared to the traditional process, the strength of the interconnect was doubled and the reliability was significantly improved in high temperature application....

Solder Joint Encapsulant Adhesive - LGA High Reliability And Low Cost Assembly Solution

Jan 12, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper....

5 more technical articles from YINCAE Advanced Materials, LLC. »

55 news releases »

YINCAE's DA158N Die Attach Materials withstanding -273°C

Mar 30, 2022 | YINCAE is excited to announce that we have developed DA158N die attach materials which is thermal conductive and electrical insulating adhesives. It can be fast cured at low temperature. The development of DA 158N is preparing the materials for people to live in the Mars.

Fully Flux Residue Compatible, Room Temperature Fast Flow, Reworkable Underfill SMT 88UL2

Dec 22, 2021 | YINCAE is excited to announce that we have developed and upgraded SMT 88UL to SMT 88UL2, a fully flux residue compatible, room temperature fast flow and easily reworkable underfill.

YINCAE's New SMT 158N Series withstanding -273°C

Feb 24, 2021 | YINCAE is excited to announce that we have developed SMT 158N series, including a non-flow, low temperature slow cure and high purity liquid epoxy underfill and capillary underfill encapsulant.

World's First Commercially Available Diamond Filled Underfill: SMT 158D8

Jan 21, 2021 | YINCAE is excited to announce that we have developed SMT 158D8 a high thermal conductive underfill that is capillary and fast-flowing, and an easy reworkable liquid epoxy.

YINCAE Advanced Materials, LLC. Proudly Announces ISO 9001:2015 Certification

Aug 04, 2020 | I could not be happier with the performance everyone at YINCAE has shown throughout the ISO 9001:2015 certification process," said Dr. Wusheng Yin, CEO of YINCAE. "This certification has demonstrated our clear desire to always operate at the highest levels of quality and efficiency. This is not just recognition of our tireless efforts to put the best products and service available on the market but that we intend to do so in the future!" YINCAE anticipates that the ISO 9001:2015 certification will help the company: • Provide quality products to meet or exceed customer's needs, expectations and requirements • Build an organization culture to focus on continual improvement and innovation • Produce products that comply with relevant laws and regulations • Ensure reliable risk management using best preventive practices

YINCAE To Exhibit at IMAPS 2019 Boston 52nd International Symposium Just 1 Month Away! Visit YINCAE at Booth #530

Sep 05, 2019 | (Albany, NY) September 3, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at Booth #530 at this year’s IMAPS 2019 Boston 52nd International Symposium on Microelectronics. The Symposium will be held at the Hynes Convention Center, in Boston, MA on October 1 - 2, 2019.

YINCAE To Exhibit at IMAPS 2019 Boston 52nd International Symposium Just 1 Month Away! Visit YINCAE at Booth #530

Sep 05, 2019 | (Albany, NY) September 3, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at Booth #530 at this year’s IMAPS 2019 Boston 52nd International Symposium on Microelectronics. The Symposium will be held at the Hynes Convention Center, in Boston, MA on October 1 - 2, 2019.

YINCAE's New NC 256 Zero Residue Flux

Aug 19, 2019 | YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.

YINCAE Advanced Materials, LLC. Proudly Announces ISO 9001:2015 Certification

Jul 19, 2019 | (Albany, NY) July 16, 2019 We’re proud to announce that YINCAE has received its official ISO 9001:2015 certification! This certification is a testament of YINCAE’s commitment to customer satisfaction, quality, and continuous improvement.

YINCAE Advanced Materials to Exhibit and Present at IMAPS 2019 Boston 52nd International Symposium on Microelectronics

Jul 15, 2019 | (Albany, NY) July 15, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS 2019 Boston 52nd International Symposium on Microelectronics, at the Hynes Convention Center, in Boston, MA on October 1 - 2, 2019.

45 more news releases from YINCAE Advanced Materials, LLC. »

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