Headpcb Products
SMT Products and Services offered by Headpcb
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- Headpcb Products
Head Electronics Co., Limited (Headpcb), established in 2001, is one of leading quick turn PCB manufacturer who specializes in L2~L30 high-mix, low volume and quickturn prototype PCB for high-tech industries in 30 countries. »»
Headquarters: Shenzhen, China
Manufacturer, Manufacturer, Manufacturer, Manufacturer Manufacturer
27 listed by Headpcb
Product |
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HIGH HEAT DISSIPATION MCPCBProject Description | Parameters 1 Layer Thickness: 1.2+/-0.1 mm Min Hole Size: 3.175 mm Width/Space: 0.12mm/0.1 mm Surface Treatment: OSP<...
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ALUMINUM CLAD PCBProject Description
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2 Layer
Thickness: 1.6+/-0.1 mm
Min Hole Size: 0.65 mm
Width/Space: 0.1mm/0.08 mm
Surface Treatment: OSP
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20 Layer Rigid-Flex BoardProject Description | Parameters 4 Layer (1R+2F+1R) Thickness: 0.56+/-0.1 mm Min Hole Size: 0.3 mm Width/Space: 0.15mm/0.12 mm Surface Treatme...
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Single Side FPC with StiffenerProject Description | Parameters 4 Layer Thickness: 0.3+/-0.05 mm Min Hole Size: 0.2 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG<...
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Flexible PCB connectorProject Description | Parameters 4 Layer (1R+2F+1R) Thickness: 0.56+/-0.1 mm Min Hole Size: 0.3 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: EN...
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Countersink PCBProject Description
| Parameters
4 Layer
Thickness: 1.6+/-0.16 mm
Min Hole Size: 0.4 mm
Width/Space: 0.25mm/0.2 mm
Surface Treatment: ENIG
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12 Layer Back Drill PCBProject Description | Parameters 12 Layer Thickness: 2.4+/-0.24 mm Min Hole Size: 0.25 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG&...
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Castellated Holes PCBProject Description | Parameters 4 Layer Thickness: 1.8+/-0.18 mm(High Tg S1000-2 Material) Min Hole Size: 0.2 mm Width/Space: 0.15mm/0.12 mm Surfac...
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4 Layer OSP+ENIG PCBProject Description | Parameters 4 Layer Thickness: 1.2+/-0.12 mm Min Hole Size: 0.3 mm Width/Space: 0.12mm/0.12 mm Surface Treatment: ENIG<...
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Flexible PCB CableProject Description | Parameters 4 Layer Thickness: 0.25+/-0.1 mm Min Hole Size: 0.3 mm Width/Space: 0.2mm/0.15 mm Surface Treatment: Flash Go...
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10 Layer 2 Stage BVH BoardProject Description | Parameters 10 Layer (2 Stage) Thickness: 2.0+/-0.2 mm Min Hole Size: Via: 0.2 mm &...
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High Thermal Conductivity Heavy Copper BoardProject Description | Parameters 16 Layer Thickness: 3.8+/-0.03 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG <...
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Ceramic Base BoardProject Description | Parameters 2 Layer Thickness: 0.63+/-0.06 mm Min Hole Size: 0.4 mm Width/Space: 0.16mm/0.13 mm Surface Treatment: ENIG&l...
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3 Stage Stack Via HDI BoardProject Description | Parameters 10 Layer (3 Stage) Thickness: 1.6+/-0.16 mm Min Hole Size: Via: 0.25 mm ...
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Golden Finger PCBProject Description | Parameters 10 Layer Thickness: 1.6+/-0.16 mm Min Hole Size: 0.15 mm Width/Space: 0.12mm/0.1 mm Surface Treatment: ENIG+G...
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Immersion silver PCBProject Description | Parameters 2 Layer Thickness: 0.6+/-0.1 mm Min Hole Size: 0.5 mm Width/Space: 0.3mm/0.3 mm Surface Treatment: Immersion Silver...
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6 layer heavy ENIG boardProject Description | Parameters 6 Layer Thickness: 1.8+/-0.18 mm Min Hole Size: 0.25 mm Width/Space: 0.2mm/0.2 mm Surface Treatment: ENIG<...
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1 Layer Alu. PCBLayer: 1L Material: Aluminum Board thickness: 1.6mm Surface technique: ImmersionGold Minimum hole size: 0.6mm Application field: LED, Automobile ...
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4 Layer Rigid-flex PCBLayers count: 4, Flex layers count: 2, Surface treatment: Immersion gold, Minimum hole size: 0.35mm, Minimum line width/space: 8/5.9 miles, Thickness: Rigid board: 2.00mm, Flex board: 0.24mm Size: 397.89 x 555mm ...
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2 Layer FPCLayer: 2 layer Materials: PI Copper Thickness: 35um Min Board Thickness: 0.1mm Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver PI thickness: 1/2mil, 1 to 10 mil ADH thickness: 1/2mil, 1mil FPC, flexible PCB O...
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1 Layer CEM-1 CTI600 PCBLayer: 1L Base Material:CEM-1 CTI600 Board Thickness: 1.6mm Final copper: 35um Surface Finish: HAL lead free Solder mask: Matt Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture ...
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2 Layer CEM-3 pcbLayer: 2L Base Material:CEM-3 CTI300 Board Thickness: 1.6mm Final copper: 35um Surface Finish: Immersion Tin/Sn Solder mask: Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture ...
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8 Layer Mobile PCBSpecification: 8L(1+6+1) Material: FR-4 Board thickness: 1.0mm Final copper: 18um Solder mask color: Green Silkscreen: White Surface Finish: Immersion Gold Profile: Routing and stamp holes E-test: 100% Fixt...
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6 Layer I/G, Impedance PCBSpecification: 6L Material: FR-4 TG170 Board thickness: 1.6mm Final copper: 35um Solder mask color: Blue Surface Finish: Immersion Gold, Au:3u” min. Impedance control Profile: Routing E-test: 100% Fixture <...
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10 Layer Gold fingers PCBLayer: 10L Base Material:FR-4 tg180(ITEQ) Board Thickness: 1.6mm Final copper: 35um Surface Finish:Immersion Gold/Au:2u” min. Gold fingers/Au:30u” Solder mask: Green Profile: Routing E-test: 100% Fixture Quality report...
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8 layer inmmersion gold board8 layers board Basic Material: FR-4 Board Ply (thickness): 1.80mm Measurement: 254mm x 304.8mm Conductor Width: 5mil (0.13mm) Conductor Spacing: 5mil (0.13mm) Surface Treatment: Immersion gold File Format: Gerber File (RS274X) Thr...
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Back Plane BoardProject Description | Parameters 32 Layer Thickness: 6.2+/-0.62 mm Size: 870*540mm Min Hole Size: Via: 0.65 mm Width/Space: 0.1mm/0.15 m...
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