Electronic Packaging Laboratory, State University of New York
The purpose of this laboratory is to develop the computational and experimental tools needed to develop the next generation of nanoelectronics and nanophotonics devices.
Research Institute / Laboratory / School
The Electronic Packaging Laboratory is an interdisciplinary research center of the University at Buffalo, The State University of New York. The purpose of this laboratory is to develop the computational and experimental tools needed to develop the next generation of nanoelectronics and nanophotonics devices.
Conducting research for the next generation of nanoelectronics/ nanophotonics requires interdisciplinary collaboration between experts in solid mechanics, structural analysis, materials, electronics, circuits, photonics, heat transfer, fluid mechanics, manufacturing and design. The EPL strives to educate competitive and self-motivated students and professionals with state-of- the-art knowledge in interdisciplinary research in a unique interdisciplinary environment.
Our graduates have been hired by Microsoft, IBM, Analog Devices, Honda Electronics, Tyco Electronics, among many other prestigious companies.
Electronic Packaging Laboratory, State University of New York Postings
1 technical article »
Electromigration Damage Mechanics of Lead-Free Solder Joints Under Pulsed DC: A Computational Model
Jun 13, 2013 | Wei Yao, Cemal Basaran
Electromigration (EM) is a mass transportation mechanism driven by electron wind force, thermal gradient, chemical potential and stress gradient. According to Moore’s law, number of transistors on integrated circuits (ICs) doubles approximately every 2 years. Moore’s law holds true since its introduction in 1970s. This insatiable demand for smaller ICs size, larger integration and higher Input/Output (IO) count of microelectronics has made ball grid array (BGA) the most promising connection type in electronic packaging industry. This trend, however, renders EM reliability of solders joints a major bottleneck to hinder further development of electronics industry......
