National Pingtung University of Science & Technology
We recruit the people who talent with materials engineering in all region of the world.
Research Institute / Laboratory / School
National Pingtung University of Science & Technology Postings
1 technical article »
Corrosion Resistance of Pb-Free and Novel Nano-Composite Solders in Electronic Packaging
Oct 17, 2013 | L.C. Tsao
Although several commercial and experimental Pb-free solder alloys are available as replacements for Sn-Pb solders, the following families of solders are of particular interest and are the prevailing choices of industry: eutectic Sn-Ag, eutectic Sn-Cu, eutectic Sn-Zn, eutectic Bi-Sn, and Sn–In. Since the properties of the binary Pb-free solders cannot fully meet the requirements for applications in electronic packaging, additional alloying elements are added to improve the performance of these alloys. Thus, ternary and even quaternary Pb-free solders have been developed, such as Sn-Ag-Cu, Sn-Ag-Bi, and Sn-Zn-Bi solder......