Whether using aluminum or other thermal interface materials to provide the necessary thermal management, Mapletech Group has the experience in the design and fabrication of heatsink and metal core PCB's to support your requirements.
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Fabrication Services |
Mapletech Group has considerable technical knowledge and 10 years manufacturing experience in the supply of complex microwave PTFE and mixed dielectric multilayer PCBs. From simple multilayer designs through to complex metal core PCBs, Mapletech can support the most demanding RF/Microwave re...
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Materials |
Heavy copper can be used in a PCB for a variety of purposes, including high power distribution, heat dissipation, planar transformers, and power convertors.
Mapletech has been building heavy copper circuit boards with traces and copper planes of up to 6 ounces for over 10 years. Ou...
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Materials |
For over 10 years, Mapletech has been producing single to multilayer constructions of both Flexible and Rigid-Flexible circuits. We have a core flex circuit engineering team that supports the latest in customer concepts for this technology, bringing the toughest designs to market. Our capa...
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Materials |
With our combined backplane and assembly capabilities, Mapletech is structured to provide custom backplane solutions that deliver performance and overall value. Our key capabilities include the use of high performance materials for digital designs, variable copper weights to support high speed ...
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Materials |
Mapletech Group core technology and advanced capabilities are driven by our focus on fabricating complex and cutting edge High Density Interconnect (HDI) PCB's.
Through our endless effort, we can meet any design requirement of the small form factors that apply to the latest produc...
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Materials |