Sierra Assembly Technology LLC

As a contract manufacturer of high-technology electronic assemblies, Sierra Assembly provides a full range of manufacturing and engineering services. 

From prototype to production, Sierra Assembly delivers consistent quality, dependability, on-time delivery, and prompt responsiveness at all points in our processes.

Service Offered:

• PCB ASSEMBLY

• BGA & MICRO BGA PLACEMENT

• CABLE AND WIRE HARNESS ASSEMBLY

• PCB DESIGN & REVERSE ENGINEERING

• BOX BUILD ASSMEMBLY

• CONFORMAL COATING

• IC PROGRAMMING

• IN CIRCUIT TESTING/FUNCTIONAL TESTING

• X-RAY INSPECTION

• AUTOMATED OPTICAL INSPECTION

• BGA REWORK

Our Capabilities

Technical

• Laser alignment & vision systems for SMT placement.

• Auto-calibration for SMT lines.

• BGA, μ-BGA, ultra-fine pitch QFP, QFN, and CSP, FCP & 0201

placement & repair.

• Component placement to 7-mil pitch.

• High layer & ultra-dense component counts.

• On site firmware programming.

• 10-zone air convection reflow system with nitrogen atmosphere

option.

• X-Ray laminography.

• Surface Mount Addendum

• Largest BGA Size: 75mm x 75mm

• BGA Pitch Range: 0.25 mm - 3 mm

• Largest QFP Size: 75mm x 75mm

• Smallest QFP Pitch: 0.25 mm - 3 mm

• Largest PCB/Panel Size: 18" x 20"

• Smallest PCB/Panel size: 1.2" Wide

• Smallest Space between Adjacent Components: 0.005"

• Smallest Passive Component Size: 0201

• Bed of Nails (Fixture) ICT Test Station: Genrad 2280

• Component Placement Speeds:

• Juki - 12,500/Hr.

• Component Placement Accuracy:

• Juki - ±30μm (3 Sigma)

Manufacturing

• Complex RoHS & non-RoHS PCAs up to 18”x20”.

• PTH, SMT & mixed technology assembly.

• Single and double-sided assembly.

• No clean flux process & closed loop aqueous cleaning system.

• Conformal coating & potting compliant with IPC-CC-830B.

• Cable & harness assembly.

• Complete mechanical assembly.

• Fixture & fixtureless in circuit & functional testing.

• Repair/rework including BGA & QFP.

Our Comprehensive Services

Design

• Electrical, PCB & layout capabilities.

• DFT & DFM engineering support.

• Component selection/BOM creation support.

Prototyping

• Quick turn – 1 to 5 days.

• Turnkey, consignment, or mixed model.

• One piece through beta run.

• Machine & hand placement.

• Reflow and hand soldering.

NPI (NEW PRODUCT INTRODUCTION)

• Dedicated program management.

• Documentation requirements defined.

• Program review; kick off meeting & Project development.

• Final SOW, materials, processes, & schedule documentation &

sign off.

• 1st article inspections (Tooling, materials, & assembly) &

acceptance.

• Release to production.

Supply Chain Management

• Component sourcing - Full turnkey to full consignment based

on customer needs.

• BOM analysis & suggestions for cost, availability & serviceability

improvement.

• Demand aggregation for cost optimization.

• AVL management & supplier certification.

• Demand forecast & supplies management.

• RoHS & non-RoHS Inventory management.