Mechanical Devices
We develop produce and supply innovative cost effective thermal control units to major Semiconductor Devices Manufacturers to test IC devices -LOW & HIGH Power devices for temp range -65°C to +200°C.
Consultant / Service Provider, Manufacturer, Other
For your Thermal solutions we have the experience and Systems that can be found at major Semiconductor Devices Manufactures to test their IC devices. our system suit LOW & HIGH Power devices for temp range -65°C to +175°C/ +200°C,| accuracy of +/- 0.2°C | handling powerful cooling force. With enhanced transfer rates (150°C/min). They are well integrated for benchtop lab environment and with automatic test equipment (ATE) and handler in production. Mechanical Devices Temperature Test Systems are proven for environmental test assure quality and help with failure analysis by environmental stressing the device throughout the semiconductor product design and manufacturing back end test.
Mechanical Devices Postings
4 products »
FlexTC Laboratory Benchtop Temperature Forcing System From -55⁰C to +155⁰
Hi-tech Breakthrough in Fluid Free Operation • High performance and fast transition rates • Temperature accuracy of ±0.2°C • Compact and portable design • No compressed air required &b...
ECO Cool® Economical Powerful - Thermal Forcing System. (-30°C - +200°C | 0°C @ 400W).
ECO Cool® Economical Powerful - Thermal Forcing System. Exceptionally Powerful, Economical & Reliable. MD Thermal control units were designed with high efficiency and flexibility in mind, allowing...
MaxTC Power Plus - High Power thermal forcing system, Temperature system
MaxTC Power Plus was designed with high power and flexibility in mind, allowing for customization to suit different package and interface variations. The system allows for forcing tempe...
MaxTC High Power Temperature Forcing System From -65⁰C to +175⁰C / 200⁰C
https://mechanical-devices.com/portfolio-posts/flextc-temperature-forcing-system/ High-Power Temperature Forcing System Ultimate cooling power 70W@-40⁰C/185W@0⁰C From -65⁰C to +175⁰C / 200⁰C A Hi-tech Breakt...
1 technical article »
New Era in Testing DUT over Temperature
May 13, 2016 | Lior Yosef
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems....
4 news releases »
New Generation of Thermal Solutions G4
Apr 16, 2019 | Innovative Solutions, test your IC Device with confidence without ever worrying about temperature requirements
New Era in Testing DUT over Temperature
May 13, 2016 | The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
New Era in Testing DUT over Temperature
May 13, 2016 | The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
Thermal Control Units for IC Testing
Mar 14, 2016 | A better choice in thermal-forcing technology for Semiconductors IC Testing, Characterization, Validation, Reliability, FA, ATE and Production.
