XYZTEC bv
XYZTEC is the market and technology leader in bond testing worldwide. The Condor Sigma is the most advanced bond tester, providing leading customers with fully automated shear, push and pull testing.
XYZTEC, incorporated in 2000, designs and manufactures innovative equipment that is used for quality assurance to ensure the reliability of many products in multiple industries. We set the standard in Statistical Process Control (SPC). We are 100% focused on bond testing and have established our name as technology and market leader in bond testing worldwide.
Our Condor Sigma equipment is used in semiconductor, automotive and raw material industry. XYZTEC is committed to working with various research institutes and universities globally. Customer satisfaction, high quality, innovation and superior support are our priorities. XYZTEC is market leader and still growing. Customers are happy with our personal no-nonsense approach and recognize our unique selling points.
XYZTEC has seven direct offices around the world, with headquarters in Panningen, The Netherlands. Our extensive network of both distributors and regional representatives offers the very best support both locally and internationally. XYZTEC offers financial stability and access to resources that are common to large companies.
Many of our team members are renowned leading authorities in bond testing among who Bob Sykes.
Our production process is ISO9001, ISO13485 and ISO14001 certified. Currently all of our production is implemented in The Netherlands. Our goal is 100% customer satisfaction, being flexible and reliable to ensure long-term relationships with our customers. XYZTEC's products are characterized by low cost of ownership and sensible pricing for service and spares.
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Every seminar is focussed around a particular aspect of the science of bond testing.
XYZTEC bv Postings
5 products »
The Condor Sigma is the most advanced bond tester on the market, combining the unique strengths of the Condor series with the latest technologies and innovations. Full automation, 0.075% accuracy, best ergono...
Condor Sigma W12 Bond Tester - Ideal Solution for 300mm (12 inch) Wafer Testing
Fully integrated solution for automated wafer testing (up to 300 mm). The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the...
A bond tester that can grow with your company. Future proof performance and flexibility. With the Condor Sigma Lite, XYZTEC gives you a low cost entry point without sacrificing performance to meet future demands. The Cond...
CBP Jaw Cleaner (contactless cavity cleaner)
Easy and automatic CBP cavity cleaning with no mechanical jaw contact. During use solder builds up in the cavity in cold bump pull (CBP) jaws. This reduces their grip efficiency and affects the quality of your measurements. Cleani...
Many bond strength tests require a means to grip the part so that the strength of its bond can be tested. In many of these applications the geometry and force of the grip must be precisely controlled to ensure sufficient load can be applied to the...
2 technical articles »
Mechanical stress test for component solder joints and bonding wires
Aug 24, 2016 | MINIMOTOR Benelux
From consumer electronics to systems control, automotive technology to aviation and aerospace – today, electronics are absolutely essential in many sectors. They increasingly replace mechanical components, eliminating wear and tear and thereby extending the service life. What is easily forgotten in this regard is that electronics are also subject to the laws of mechanics. Mechanical test equipment is crucial to test components for the secure hold of welded, soldered or adhesive bonds. A new, mechanically intricate test probe with universal clamping jaws, that can even grasp the individual bonding wires, is in line with the trend toward ever smaller components. Serving as an actuator for these is a micro drive that can be precisely controlled using a miniaturised motion controller to relieve the control unit in the test device....
Bond Test Measurement Accuracy
Aug 23, 2016 | Bob Sykes
While many things can affect the force measurement accuracy of a bond test, its ultimate limitation is that of the force sensor. With advances in technology, accuracy can be dramatically improved with no cost penalty and no need to select force measurement ranges. How is this accomplished? ...
10 news releases »
Advances in Thin, 3D and MEMS Die Bond Strength Testing
Aug 02, 2017 | As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
Scratch and film testing throughput greatly enhanced
Dec 21, 2016 | Driven by emerging technology and to suit customer special requirements XYZTEC Condor Sigma's comprehensive range of bond tests is always increasing. One of our latest applications made scratch testing of complex coating much easier to achieve and increased throughput by several orders of magnitude.
Scratch and film testing throughput greatly enhanced
Dec 21, 2016 | Driven by emerging technology and to suit customer special requirements XYZTEC Condor Sigma's comprehensive range of bond tests is always increasing. One of our latest applications made scratch testing of complex coating much easier to achieve and increased throughput by several orders of magnitude.
Scratch and film testing throughput greatly enhanced
Dec 21, 2016 | Driven by emerging technology and to suit customer special requirements XYZTEC Condor Sigma's comprehensive range of bond tests is always increasing. One of our latest applications made scratch testing of complex coating much easier to achieve and increased throughput by several orders of magnitude.
Latest Condor Sigma software release enables automatic grading
Dec 02, 2016 | One of the most exciting additions in version 5.8 of the Condor Sigma software is automatic grading for ball shear testing. Using the advanced Halcon library and high resolution perpendicular cameras with smart lighting systems, we have achieved successful determinations of failure modes for several customers. The computer can accurately determine the percentages of brittle and ductile failures.
Vision enhanced materials testing
Nov 02, 2016 | The market leading bond tester Condor Sigma can be equipped with a camera to do motion and strain analysis. It includes a wide variety of visualization options.
Sep 30, 2016 | In this newsletter we describe a new method of testing the seal and adhesive quality of a lid encapsulated devices.
XYZTEC automation features draw attention at Semicon Taiwan 2016
Sep 08, 2016 | This week, XYZTEC is exhibiting the Condor Sigma at Semicon Taiwan. With two booths at the central TWTC Nangang Hall (4F), the market leader in bond testing is attracting a lot of attention. Many customers are automating their facilities and therefore come to see the latest advances in automation that the Condor Sigma and the 300mm (12 inch) wafer testing Condor Sigma W12 have to offer.
XYZTEC launches Condor Sigma W12 with large heater stage
Sep 02, 2016 | We present the market leading Condor Sigma W12, equipped with a rotating 13500W 518x513mm heater stage that can uniformly warm up your sample to temperatures up to 175°C. The system is designed for die shear testing on large rectangular glass carriers and 12 inch round carriers, to test glued or solder interconnections on a coating.
HTMG represents XYZTEC in South America
Aug 23, 2016 | High Technology and Materials Group (HTMG) recently signed on as XYZTEC's exclusive sales and service representative for Brazil. HTMG has its headquarters in Sao Paulo, Brazil and offers high performance innovations in components and materials to several business areas in South America since 1999.
