Improvement of Organic Packaging Thermal Cycle Performance Measurement

Published:

November 1, 2006

Author:

Glenn O. Dearing, Paul J. Hart

Abstract:

Flip Chip Plastic Ball Grid Array (FCPBGA) modules, when subjected to extreme environmental stress testing, may often reveal mechanical and electrical failure mechanisms which may not project to the field application environment. One such test can be the Deep Thermal Cycle (DTC) environmental stress which cycles from -55°C to 125°C. This “hammer” test provides the customer with a level of security for robustness, but does not typically represent conditions which a module is likely to experience during normal handling and operation....

  • Download Improvement of Organic Packaging Thermal Cycle Performance Measurement article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

International Business Machines Corporation is a multinational technology. IBM manufactures computer hardware and software, offers infrastructure, hosting and consulting services.

Armonk, New York, USA

Consultant / Service Provider, Other

  • Phone 800-IBM-4YOU

See Company Website »

Company Postings:

(4) technical library articles

(1) news release

  • Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
  • Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
  • Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
  • Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
  • Browse Technical Library »

Improvement of Organic Packaging Thermal Cycle Performance Measurement article has been viewed 496 times

Flux-Free Reflow Soldering

Fluid Dispense Pump Integration