New BGA Solder Mask Repair Technique Using Laser Cut Stencils
Published: |
February 1, 2007 |
Author: |
Ronald D. Schaeffer, Chief Executive Officer, Photomachining. |
Abstract: |
The increased replacement of high lead count SMT devices with BGAs and other high ball count area array packages has brought increased challenges to PCB rework and repair. Often solder mask areas surrounding BGA pad areas are damaged when components are removed.... |
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