Phase Convection™: The Lead-Free Solution
Published: |
May 30, 2007 |
Author: |
Jean-Jack Boumendil, Pascal Preti. |
Abstract: |
Transition to lead-free is accelerating and when considering constraints related to lead-free and conventional solder pastes, one concern is rising: flexibility. It would be dangerous to commit to lead-free only while the technology is not yet stabilized. Manufacturers need to consider all of the issues related to lead-free and need to find flexible equipment which are able to adapt to both conventional and lead-free constraints.... |
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