Package on Package (PoP) Stacking and Board Level Reliability, Results of Joint Industry Study
Published: |
August 2, 2007 |
Author: |
Moody Dreiza, Lee Smith - Amkor Technology, Gene Dunn - Panasonic Factory Solutions, Niranjan Vijayaragavan, Jeremy Werner - Spansion. |
Abstract: |
This paper presents the results of a joint - three way study between Amkor Technology, Panasonic Factory Solutions and Spansion in the area of package on package (PoP) board level reliability (BLR) (...) The scope of this paper is to cover the already popular 14 x 14mm PoP package size that provides a 152 pin stacked interface which supports a high level of flexibility in the memory architecture for multimedia requirements.... |
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