Laser Solder Reflow: A Process Solution Part I
Published: |
September 6, 2007 |
Author: |
John Vivari; EFD, Inc., Alex Kasman, Leister Technologies USA |
Abstract: |
EFD Inc. and Leister USA have collaborated to bust the myth that you cannot perform laser reflow with solder paste. Using Leister diode lasers, EFD has formulated solder pastes that survive the rapid reflow cycle typical of laser heating. These solder pastes reflow and wet well, without spatter, even when heating is accomplished in less than half a second. The flux core in wire solders cannot boast such flux spatter resistance in such an aggressive heating environment.... |
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