Laser Solder Reflow: A Process Solution Part I
Published: |
September 6, 2007 |
Author: |
John Vivari; EFD, Inc., Alex Kasman, Leister Technologies USA |
Abstract: |
EFD Inc. and Leister USA have collaborated to bust the myth that you cannot perform laser reflow with solder paste. Using Leister diode lasers, EFD has formulated solder pastes that survive the rapid reflow cycle typical of laser heating. These solder pastes reflow and wet well, without spatter, even when heating is accomplished in less than half a second. The flux core in wire solders cannot boast such flux spatter resistance in such an aggressive heating environment.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Nordson EFD »
- Sep 13, 2007 - Laser Solder Reflow: A Process Solution Part II
- Jan 31, 2007 - Reflow Profiling Guide
- Jan 31, 2007 - Auger Valve Dispensing
- Jan 31, 2007 - Air Powered Dispensing
- Jan 03, 2007 - Dispensing Solder Paste Micro-Deposits to 0.2mm - A Process Solution
- See all SMT / PCB technical articles from Nordson EFD »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Laser Solder Reflow: A Process Solution Part I article has been viewed 869 times