Maximizing Process Control with Controlled Convection Rates
Published: |
October 10, 2007 |
Author: |
Rob DiMatteo, Fred Dimock, Pierre LeMieux. |
Abstract: |
Process engineers, who are seeking to achieve the most effective and reproducible thermal transfer process, look to today's forced convection ovens for applications such as flipchip, BGA, and lead-free soldering. A forced convection process to maximize thermal uniformity can be best accomplished by employing static pressure generation in what's known as "closed loop convection".... |
You must be a registered user to talk back to us. |
Company Information:
More articles from BTU International »
- Apr 21, 2021 - Operation of a Vacuum Reflow Oven with Void Reduction Data
- Oct 24, 2019 - Thermal Profiles - Why Getting Them Right is Important
- Dec 06, 2007 - Lead-Free Solder Wafer Bumping
- Nov 08, 2007 - Making A Case for Continuous Furnaces
- See all SMT / PCB technical articles from BTU International »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Maximizing Process Control with Controlled Convection Rates article has been viewed 776 times