Effect of Contact Time on Lead-Free Wave Soldering
Published: |
August 28, 2008 |
Author: |
Jim Morris, Richard Szymanowski |
Abstract: |
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics of the solder wave for adequate hole fill is an essential step in achieving a reliable process. A variety of solder waves exist in the industry; each with advantages and disadvantages when performing lead-free wave soldering. One way to ensure adequate hole-fill is by increasing contact time at the Chip Wave.... |
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