Facedown Low-Inductance Solder Pad and Via Schemes
Published: |
September 4, 2008 |
Author: |
John Prymak, Erik Reed, Allen Mayar |
Abstract: |
In the quest for lower ESL devices, having the ESL reduced in the package is only half of the battle; connecting that device to the circuit determines how much of that low ESL appears to the circuit. For this low ESL part type, it would be a shame to take a part of 200 pH and add 2000 pH to its ESL because of via patterns on the PCB.... |
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