If you bear the cost of your product's failure, shouldn't you have a say in ensuring it's success?
Published: |
April 9, 2009 |
Author: |
ECD |
Abstract: |
Evidence has come to light that increased solder process temperatures, specifically for lead free solder, are dramatically shortening life expectancy of components; failures do not show up during initial test, but much later on in the products life, ... |
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