How to Profile a PCB
Published: |
April 22, 2009 |
Author: |
P. John Shiloh, John Malboeuf. |
Abstract: |
An optimal reflow profile is one of the most critical factors in achieving quality solder joints on a printed circuit board (PCB) assembly with surface mount components. A profile is a function of temperatures applied to the assembly over time. When graphed on a Cartesian plane, a curve is formed that represents the temperature at a specific point on the PCB, at any given time, throughout the reflow process.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from DDM Novastar Inc »
- Dec 23, 2009 - Horizontal Convection Reflow Technology Defined
- See all SMT / PCB technical articles from DDM Novastar Inc »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
How to Profile a PCB article has been viewed 652 times
