Flexible Termination - Reliability in Stringent Environments
Published: |
May 21, 2009 |
Author: |
John Prymak, Corey Antoniades, Peter Blais, Allen Hill, Ken Lai, Mark Laps, Kevin Lynn, Reggie Phillips, Corey Riedl, Axel Schmidt, Bill Sloka, Paul Staubli; KEMET Corporation. |
Abstract: |
Failure due to board flex cracks persists as the dominant failure mode in multi-layer ceramic capacitors (MLCC). (...) This paper is intended to show the impact of temperature cycling, high-temperature life tests, and multiple bend exposures to the MLCC with this flexible termination.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from KEMET Electronics Corporation »
- Jan 22, 2015 - High Temperature Ceramic Capacitors for Deep Well Applications
- Jul 07, 2011 - SMD Naked Capacitors Technologies For Severe Application Environments And Circuit Functions
- Jun 02, 2009 - Soldering of SMD Film Capacitors in Practical Lead Free Processes
- Oct 23, 2008 - Flex Crack Mitigation
- Sep 04, 2008 - Facedown Low-Inductance Solder Pad and Via Schemes
- See all SMT / PCB technical articles from KEMET Electronics Corporation »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Flexible Termination - Reliability in Stringent Environments article has been viewed 703 times