Drop Shock Reliability of Lead-Free Alloys - Effect of Micro-Additives
Published: |
June 11, 2009 |
Author: |
Ranjit S Pandher, Brian G Lewis, Raghasudha Vangaveti, Bawa Singh |
Abstract: |
The shock reliability of solder joints has become a major issue for the electronic industry partly because of the ever increasing popularity of portable electronics and partly due the transition to lead free solders.... |
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