Model Management for Predictive Accuracy
Published: |
September 2, 2009 |
Author: |
Accuracy Competence Management, Assembléon BV. |
Abstract: |
The current trend of miniaturization in products and substrates is expected to continue in most advanced electronic products. Telecommunication and computer applications typically need high density connection boards incorporating smaller passive components, finer pitch IC’s and area array packages. The key factor in the technically successful evolution is the development of new interconnection processes, such as the use of conductive adhesive with very fine grained inter-connection materials.... |
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