Advanced Thermal Interface Materials for Enhanced Flip Chip BGA
Published: |
January 6, 2010 |
Author: |
Punit Kohli, Martin Sobczak, Jeff Bowin, Michael Matthews - Henkel / Ablestik Laboratories |
Abstract: |
Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient manner. Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader.... |
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