Challenges of Lead-Free Low Silver Content End Termination Pastes for Inductor Applications
Published: |
August 19, 2010 |
Author: |
Dong Zhang, Meg Tredinnick, Mark Challingsworth |
Abstract: |
The silver end termination plays an important role for multilayer chip inductors. A basic requirement is to achieve excellent electrical properties with superior adhesion to the chip. Driven by the increasing price of silver, interest has been shown to ... |
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