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Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling

Published:

January 6, 2011

Author:

Brian O' Leary, Tim Grove, Dr. S. Manian Ramkumar

Abstract:

The oven recipe, which consists of the reflow oven zone temperature settings and the speed of the conveyor, will determine a specific time‐temperature profile for a given PCB assembly. In order to achieve a good quality PCB assembly, the time‐temperature ...

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Company Information:

KIC's provides products and services designed to improve a variety of thermal monitoring, profiling and process control applications.

San Diego, California, USA

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