Quantitative Evaluation of New SMT Stencil Materials
Published: |
June 29, 2011 |
Author: |
Chrys Shea, Quyen Chu, Sundar Sethuraman, Rajoo Venkat ,Jeff Ando, Paul Hashimoto |
Abstract: |
High yields in the stencil printing process are essential to a profitable SMT assembly operation. But as circuit complexity continues to increase, so do the challenges of maintaining a successful solder paste deposition process. To help assemblers address... |
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