An Investigation of Whisker Growth on Tin Coated Wire and Braid
Published: |
August 2, 2012 |
Author: |
Dave Hillman, Tim Pearson, Thomas Lesniewski |
Abstract: |
First published in the 2012 IPC APEX EXPO technical conference proceedings. Pure tin is a common finish for copper hook up wire, coaxial cable, ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports o... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Rockwell Collins »
- Jan 05, 2015 - The Last Will And Testament of the BGA Void
- Apr 29, 2008 - The Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity.
- See all SMT / PCB technical articles from Rockwell Collins »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
An Investigation of Whisker Growth on Tin Coated Wire and Braid article has been viewed 585 times
