Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints
Published: |
September 13, 2012 |
Author: |
Ward Gatza; Agilent Technologies, Inc., Tom Evans; Thomas C. Evans Consulting |
Abstract: |
First published in the 2012 IPC APEX EXPO technical conference proceedings. Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor... |
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Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints article has been viewed 475 times
davef
September 18, 2012
Hi Ward ... Neat study. Too bad the sample size wasn't larger. So, what are your plans to move forward with this project and develop a better understanding of the effect on the reliability of various reflow technologies?