Best Practices Reflow Profiling for Lead-Free SMT Assembly

Published:

June 5, 2013

Author:

Ed Briggs and Ronald C. Lasky, Ph.D., PE.

Abstract:

The combination of higher lead-free process temperatures, smaller print deposits, and temperature restraints on electrical components has created difficult challenges in optimizing the reflow process. Not only are the electronic components and the PWB at risk, but the ability to achieve a robust solder joint becomes difficult, especially if the PCB is thermally massive. In addition, the constant miniaturization of electronic components, hence smaller solder paste deposits, may require the use of smaller particle-sized powders (...) This paper is a summary of best practices in optimizing the reflow process to meet these challenges of higher reflow temperatures, smaller print deposits, decreased powder particle size, and their affect on the reflow process....

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Company Information:

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer

  • Phone 315-853-4900
  • Fax 315-853-1000

See Company Website »

Company Postings:

(10) products in the catalog

(27) technical library articles

(357) news releases

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