Effect of Reflow Profile on Intermetallic Compound Formation

Published:

October 24, 2013

Author:

I. Siti Rabiatull Aisha, A. Ourdjini, M. A. Azmah Hanim, O. Saliza

Abstract:

Reflow soldering in a nitrogen atmosphere is a common process consideration in surface mount technology assembly. This is because the use of nitrogen in reflow equipment may benefit the process as well as the quality of the end product, where it can increase the reliability of the solder joint. (...) The present study investigated thoroughly the effect of different reflow soldering atmosphere, which is air and nitrogen on IMC formation and growth...

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Company Information:

The FKE was established in late 1974. Since 1st June 1995, the faculty commences operation at the main campus of the University in Skudai, Johor until today.

Johor, Malaysia

Research Institute / Laboratory / School

  • Phone +607–553-0692
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