High Performance Multilayer PCBs Design and Manufacturability
Published: |
October 31, 2013 |
Author: |
Judy Warner, Chris Savalia; Transline Technology, Michael Ingham; Spectrum Integrity |
Abstract: |
Multilayer printed circuit boards (PCBs) that utilize high performance materials are inherently far more challenging for a fabricator to build, due to significant material property differences over standard epoxy glass FR4. These unique material characteristics often require higher processing temperatures, special surface treatments (to aid in hole and surface plating), they possess different expansion properties, making layer-to-layer registration more difficult to control, and require many other unique considerations.... |
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