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Thermal Shock and Drop Test Performance of Lead-free Assemblies with No-Underfill and Corner-Underfill

Published:

January 2, 2014

Author:

Bankeem Chheda and S. Manian Ramkumar, Ph.D.; Rochester Institute of Technology-CEMA, Reza Ghaffarian; Ph.D. Jet Propulsion Laboratory.

Abstract:

With ROHS compliance the transition to lead-free is inevitable. Several lead-free alloys are available in the market and its reliability has been the main concern. The results from this experimental research aims at making a comparison of different lead-free alloy combinations. Thermal shock and drop tests are a part of this experimental study....

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The JPL is the lead U.S. center for robotic exploration of the solar system, and conducts major programs in space-based Earth sciences and astronomy.

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