Understanding SIR
Published: |
February 6, 2014 |
Author: |
Chris Nash, Technical Support Engineer, Eric Bastow, Senior Technical Support Engineer; Indium Corporation. |
Abstract: |
Many electronics manufacturers perform SIR testing to evaluate solder materials and sometimes the results they obtain differ significantly from those stated by the solder material provider. The difference in the results is typically the result of SIR coupon preparation. This paper will discuss the issue of SIR coupon preparation, board cleaning techniques, and how board cleanliness directly affects SIR results.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Indium Corporation »
- Dec 29, 2020 - D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding
- Nov 24, 2020 - The Risk And Solution For No-Clean Flux Not Fully Dried Under Component Terminations the Risk And Solution For No-Clean Flux Not Fully Dried Under Component Terminations
- Jul 24, 2019 - Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies
- Dec 19, 2018 - Process Optimization for Fine Feature Solder Paste Dispensing
- Nov 20, 2018 - Understanding the Effect of Different Heating Cycles on Post-Soldering Flux Residues and the Impact on Electrical Performance
- See all SMT / PCB technical articles from Indium Corporation »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Understanding SIR article has been viewed 689 times