Microspring Characterization and Flip-Chip Assembly Reliability
Published: |
May 29, 2014 |
Author: |
B. Cheng, D. De Bruyker, C. Chua, K. Sahasrabuddhe, I. Shubin, J. E. Cunningham, Y. Luo, K. F. Böhringer, A. V. Krishnamoorthy, E, M. Chow |
Abstract: |
Electronics packaging based on stress-engineered spring interconnects has the potential to enable integrated IC testing, fine pitch, and compliance not readily available with other technologies. We describe new spring contacts which simultaneously achieve low resistance (< 100 mΩ) and high compliance (> 30 μm) in dense 2-D arrays (180 ~ 180-µm pitch). Mechanical characterization shows that individual springs operate at approximately 150-µN force. Electrical measurements and simulations imply that the interface contact resistance contribution to a single contact resistance is < 40 mΩ. A daisy-chain test die consisting of 2844 contacts is assembled into flip-chip packages with 100% yield. Thermocycle and humidity testing suggest that packages with or without underfill can have stable resistance values and no glitches through over 1000 thermocycles or 6000 h of humidity. This paper suggests that integrated testing and packaging can be performed with the springs, enabling new capabilities for markets such as multichip modules.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Institute of Electrical and Electronics Engineers (IEEE) »
- Jun 27, 2022 - A Review and Analysis of Automatic Optical Inspection and Quality Monitoring Methods in Electronics Industry
- Aug 22, 2018 - Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications
- Apr 03, 2014 - A System Level Electrostatic Discharge Protection Modeling Methodology for Time Domain Analysis.
- See all SMT / PCB technical articles from Institute of Electrical and Electronics Engineers (IEEE) »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Microspring Characterization and Flip-Chip Assembly Reliability article has been viewed 687 times