Enhancing Mechanical Shock Performance Using Edgebond Technology
Published: |
June 26, 2014 |
Author: |
Steven Perng, Tae-Kyu Lee, and Cherif Guirguis - Cisco Systems, Inc., Edward S. Ibe - Zymet, Inc. |
Abstract: |
Edgebond adhesives have been widely used by the industry for improving the shock performance of area array packages. Most of the studies focus on the impact of material properties, such as coefficient of thermal expansion (CTE) and glass transition temperature (Tg), on reliability at room temperature. However, the operating temperature of a component on the printed circuit board bonded with edgebond adhesive can be close to or exceed Tg of the adhesive, where the material properties may be very different than at room temperature.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Cisco Systems, Inc. »
- May 15, 2019 - Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle
- Apr 25, 2013 - Determination of Copper Foil Surface Roughness from Micro-section Photographs
- Jan 03, 2013 - Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission
- See all SMT / PCB technical articles from Cisco Systems, Inc. »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Enhancing Mechanical Shock Performance Using Edgebond Technology article has been viewed 795 times