Numerical Study on New Pin Pull Test for Pad Cratering Of PCB
Published: |
February 19, 2015 |
Author: |
Billy Hu, Jesus Tan |
Abstract: |
Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method with solder ball attached and positioning the test board at an angle of 30º is employed to study the strength of pad cratering. This new method clearly reveals the failure mechanism. And a proper way to interpret the finite element analysis (FEA) result is discussed. Impact of pad dimension, width and angle of copper trace on the strength is included. Some findings not included in previous research could help to guide the design for better performance... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Flex (Flextronics International) »
- Jan 23, 2019 - AOI Capabilities Study with 03015 Component
- Jun 15, 2017 - Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT)
- Oct 27, 2016 - Press Fit Technology Roadmap and Control Parameters for a High Performance Process
- Sep 01, 2016 - Reliability Study of Low Silver Alloy Solder Pastes
- Aug 18, 2016 - Selective Reflow Rework Process
- See all SMT / PCB technical articles from Flex (Flextronics International) »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Numerical Study on New Pin Pull Test for Pad Cratering Of PCB article has been viewed 527 times
