Profiling for Successful BGA/CSP Rework
Published: |
August 14, 2013 |
Author: |
Metcal |
Abstract: |
This paper discusses how to successfully profile a printed circuit board when reworking Ball Grid Array and Chip Scale Packages.... |
|
|
|
|
|
|
You must be a Company Information:
- Jan 02, 2019 - Risk Mitigation in Hand Soldering
- Feb 22, 2018 - Hand Soldering with Lead Free Alloys
- Apr 23, 2015 - Rework Challenges for Smart Phones and Tablets
- Nov 27, 2012 - Effective Qualification of Soldering Iron Performance Criteria
- Nov 12, 2012 - Increase Your Process Control and Lower Cost of Ownership
- See all SMT / PCB technical articles from Metcal »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Profiling for Successful BGA/CSP Rework article has been viewed 1011 times
