Sample Preparation For Mitigating Tin Whiskers In Alternative Lead-Free Alloys
Published: |
February 18, 2016 |
Author: |
Mehran Maalekian, Karl Seelig, Timothy O'Neill |
Abstract: |
As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry. Current research shows that there is no perfect alloy for all cases of electronic usage. Industry leaders and researchers continue to study and search for a lead free alloy that is able to withstand harsh environments while maintaining high reliability.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from AIM Solder »
- Jun 20, 2022 - AIM Tech Tip Article: Pretty Slick
- Sep 26, 2018 - Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction
- Apr 13, 2017 - A Study to Determine the Impact of Solder Powder Mesh Size and Stencil Technology Advancement on Deposition Volume when Printing Solder Paste
- Mar 04, 2015 - Conformal Coating over No Clean Flux Residues
- May 12, 2014 - Lead-Free Soldering Guide
- See all SMT / PCB technical articles from AIM Solder »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Sample Preparation For Mitigating Tin Whiskers In Alternative Lead-Free Alloys article has been viewed 654 times
