Embedding Passive and Active Components: PCB Design and Fabrication Process Variations
Published: |
June 16, 2016 |
Author: |
Vern Solberg |
Abstract: |
Embedding components within the PC board structure is not a new concept. Until recently, however, most embedded component PC board applications adapted only passive elements. The early component forming processes relied on resistive inks and films to enable embedding of resistor and capacitors elements. Although these forming methods remain viable, many companies are choosing to place very thin discrete passive components and semiconductor die elements within the PC board layering structure. In addition to improving the products performance, companies have found that by reducing the component population on the PC board's surface, board level assembly is less complex and the PC board can be made smaller, The smaller substrate, even when more complex, often results in lower cost. Although size and cost reductions are significant attributes, the closer coupling of key elements can also contribute to improving functional performance. This paper focuses on six basic embedded component structure designs described in IPC-7092.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Vern Solberg - Solberg Technical Consulting »
- Sep 14, 2017 - 2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
- See all SMT / PCB technical articles from Vern Solberg - Solberg Technical Consulting »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Embedding Passive and Active Components: PCB Design and Fabrication Process Variations article has been viewed 546 times