Component Level Reliability For High Temperature Power Computing With SAC305 And Alternative High Reliability Solders
Published: |
February 16, 2017 |
Author: |
Thomas Sanders, Sivasubramanian Thirugnanasambandam and John Evans, Ph.D., Michael Bozack, Ph.D., Jeff Suhling, Ph.D. - Auburn University, Wayne Johnson, Ph.D. - Tennessee Tech University |
Abstract: |
This experiment considers the reliability of a variety of different electronic components and evaluates them on 0.200” power computing printed circuit boards with OSP. Single-sided assemblies were built separately for the Top-side and Bottom-side of the boards. This data is for boards on the FR4-06 substrate. This paper was originally published by SMTA in the Proceedings of SMTA International.... |
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