High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass Interposers
Published: |
August 10, 2017 |
Author: |
Sukhadha Viswanathan, Tomonori Ogawa, Kaya Demir, Timothy B. Huang, P. Markondeya Raj, Fuhan Liu, Venky Sundaram, Rao Tummala |
Abstract: |
This paper demonstrates the high frequency performance and thermo-mechanical reliability of through vias with 25 μm diameter at 50 μm pitch in 100 μm thin glass substrates. Scaling of through via interconnect diameter and pitch has several electrical performance advantages for high bandwidth 2.5D interposers as well as mm-wave components for 5G modules.... |
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