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Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Published:

January 28, 2020

Author:

Heller Industries

Abstract:

This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers....

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Company Information:

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Florham Park, New Jersey, USA

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  • Phone 973-377-6800
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