A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS
Published: |
July 2, 2020 |
Author: |
Ranjit Pandher, Rahul Raut, Michael Liberatore, Navendra Jodhan, and Karen Tellefsen |
Abstract: |
Head-in-Pillow (HIP) defects are a growing concern in the electronics industry. These defects are usually believed to be the result of several factors, individually or in combination. Some of the major contributing factors include: surface quality of the BGA spheres, activity of the paste flux, improper placement / misalignment of the components, a non-optimal reflow profile, and warpage of the components. To understand the role of each of these factors in producing head-in-pillow defects and to find ways to mitigate them, we have developed two in-house tests.... |
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A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS article has been viewed 602 times
Bob Willis
July 3, 2020
There seems to be a problem with the link to the paper A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS error 404