D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding
Published: |
December 29, 2020 |
Author: |
Kim Flanagan and Greg Wade |
Abstract: |
Voiding in bottom termination components (BTCs) like QFNs and LGAs have become quote the hot topic in the SMT industry. Surprisingly, one type of BTC component that is observed to have excessive amounts of voiding is the DPAK. One would think that a component with leads located on only one side would mitigate flux entrapment and allow outgassing to escape more easily from beneath the component, as compared to other BTCs where the component is affixed to the PCB on two or more sides. However, the exact opposite has been observed in most cases.... |
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