Operation of a Vacuum Reflow Oven with Void Reduction Data
Published: |
April 21, 2021 |
Author: |
Fred Dimock |
Abstract: |
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from BTU International »
- Oct 24, 2019 - Thermal Profiles - Why Getting Them Right is Important
- Dec 06, 2007 - Lead-Free Solder Wafer Bumping
- Nov 08, 2007 - Making A Case for Continuous Furnaces
- Oct 10, 2007 - Maximizing Process Control with Controlled Convection Rates
- See all SMT / PCB technical articles from BTU International »
More SMT / PCB assembly technical articles »
- Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
- Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
- Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
- Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
- Oct 06, 2021 - Cleaning Before Conformal Coating | ZESTRON Americas
- Browse Technical Library »
Operation of a Vacuum Reflow Oven with Void Reduction Data article has been viewed 306 times